Title:
A closure sheet covering semiconductor device, its manufacturing method, a semiconductor device, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6055259
Kind Code:
B2
Abstract:
An encapsulating sheet-covered semiconductor element includes a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface that is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface and the exposed surface has the other side portion that is positioned toward the other side with respect to the one surface of the semiconductor element.
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Inventors:
Hiroyuki Katayama
Takashi Kondo
Yuki Ebe
Munehisa Mitani
Takashi Kondo
Yuki Ebe
Munehisa Mitani
Application Number:
JP2012221656A
Publication Date:
December 27, 2016
Filing Date:
October 03, 2012
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L33/50
Domestic Patent References:
| JP2011253998A | ||||
| JP2012516026A | ||||
| JP2012033823A | ||||
| JP2007019096A | ||||
| JP2009117833A |
Foreign References:
| WO2013005646A1 |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda