Title:
無電解析出で使用するための触媒溶液の塗布方法
Document Type and Number:
Japanese Patent JP2011515581
Kind Code:
A
Abstract:
An improved method of activating a surface to receive electroless metal plating thereon, particularly for use in activating through holes in printed circuit substrates, in which the activating solution comprising a palladium tin colloid in an acidic aqueous matrix is sparged with nitrogen gas to slow the oxidation of stannous tin contained therein. A dynamic flood conveyorized system to perform said activation is described.
Inventors:
William Disesare
James Watkowski
James Watkowski
Application Number:
JP2011500840A
Publication Date:
May 19, 2011
Filing Date:
February 26, 2009
Export Citation:
Assignee:
MACDERMID,INCORPORATED
International Classes:
C23C18/18
Domestic Patent References:
| JP2008013783A | 2008-01-24 | |||
| JP2008013783A | 2008-01-24 | |||
| JPS61246372A | 1986-11-01 | |||
| JP2007162122A | 2007-06-28 | |||
| JPH0860376A | 1996-03-05 |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Yoshihiro Nagare
Naoko Matsuda