Title:
コイル装置
Document Type and Number:
Japanese Patent JP7469958
Kind Code:
B2
Abstract:
A coil device includes a core, a coil, a mounting part, and a bottom raising part. The coil is at least partly disposed close to the core. The mounting part is mounted on an installation surface. The bottom raising part is connected with the coil and extends to the mounting part so as to form a gap having a predetermined height between the mounting part and a bottom surface of the core.
Inventors:
Wang Chen
Satoshi Sugimoto
Satoshi Sugimoto
Application Number:
JP2020093499A
Publication Date:
April 17, 2024
Filing Date:
May 28, 2020
Export Citation:
Assignee:
SAE Magnetics(H.K.)Ltd.
International Classes:
H01F17/06; H01F27/28; H01F27/29
Domestic Patent References:
| JP2017139356A | ||||
| JP2019134147A | ||||
| JP2019204845A | ||||
| JP2009141200A | ||||
| JP2020053555A |
Foreign References:
| US20170178797 | ||||
| US20140292459 | ||||
| US20080231406 |
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation