Title:
CONDUCTIVE RADIUS FILLER SYSTEM AND METHOD
Document Type and Number:
Japanese Patent JP2017154723
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide composite structures having reduced-area radius fillers and methods of forming the same that provide significant advantages over known structures and methods.SOLUTION: A system has one or more over-arching systems 100 connected to one or more conductive radius fillers 70 via one or more conductive radius filler connections 94, forming one or more current handling systems 125. The one or more current handling systems 125 include one or more of an edge glow handling system configured to handle an edge glow, an electrostatic dissipation handling system configured to handle electrostatic dissipation, and a current return handling system configured to handle current return.SELECTED DRAWING: Figure 3A
Inventors:
AMERICA O SCHAAF
ELISE RAE E CASTORINA
GABRIEL Z FORSTON
PATRICE K ACKERMAN
ELISE RAE E CASTORINA
GABRIEL Z FORSTON
PATRICE K ACKERMAN
Application Number:
JP2016199010A
Publication Date:
September 07, 2017
Filing Date:
October 07, 2016
Export Citation:
Assignee:
BOEING CO
International Classes:
B64D45/02; B64C1/00; B64F5/00
Domestic Patent References:
| JP2015147411A | 2015-08-20 | |||
| JP2001510422A | 2001-07-31 | |||
| JP2011520690A | 2011-07-21 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Tatsuhiko Abe
Kuroda Shinpei
Choi
Tatsuhiko Abe
Kuroda Shinpei
Choi
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