Title:
The conductive polymer thick film constituent which can be soldered
Document Type and Number:
Japanese Patent JP6189886
Kind Code:
B2
Abstract:
A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.
Inventors:
Sharvaji Samsung
Gravey Steven
Gravey Steven
Application Number:
JP2015041137A
Publication Date:
August 30, 2017
Filing Date:
March 03, 2015
Export Citation:
Assignee:
Heraeus Precious Metals North America Conshohawk Ken LRC
International Classes:
C08L61/04; C08K3/08; C08K7/00
Domestic Patent References:
| JP62164757A | ||||
| JP2014503614A | ||||
| JP5212579A | ||||
| JP58042651A | ||||
| JP3021659A | ||||
| JP61040316A | ||||
| JP2016172A |
Attorney, Agent or Firm:
Hayashi Ichiyoshi