Title:
A dicing Die bond film with a separator
Document Type and Number:
Japanese Patent JP6053457
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dicing and die bonding film with a separator, capable of easily peeling a dicing and die bonding film off from a separator.SOLUTION: The dicing and die bonding film with a separator formed by laminating a separator, a die bonding film having a projected extension piece on an outside at the periphery in plan view, and dicing film in this order.
Inventors:
Yuki Sugo
Shuhei Murata
Kenji Onishi
Yudai Kimura
Yuichiro Yanagi
Goichi Inoue
Shuhei Murata
Kenji Onishi
Yudai Kimura
Yuichiro Yanagi
Goichi Inoue
Application Number:
JP2012240211A
Publication Date:
December 27, 2016
Filing Date:
October 31, 2012
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/301; C09J7/02; H01L21/52
Domestic Patent References:
| JP2012039023A | ||||
| JP2005162818A | ||||
| JP2012033672A | ||||
| JP2011142206A | ||||
| JP2011029412A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office