Title:
The diode laser fiber array for granular material floor manufacture or repair
Document Type and Number:
Japanese Patent JP6225263
Kind Code:
B2
Abstract:
A method of forming a build in a powder bed includes emitting a plurality of laser beams from selected fibers of a diode laser fiber array onto the powder bed, the selected fibers of the array corresponding to a pattern of a layer of the build; and simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build. An apparatus for forming a build in a powder bed includes a diode laser fiber array including a plurality of diode lasers and a plurality of optical fibers corresponding to the plurality of diode lasers, each optical fiber configured to receive a laser beam from a respective diode laser and configured to emitting the laser beam; a support configured to support a powder bed or a component configured to support the powder bed at a distance from ends of the optical fibers; and a controller configured to control the diode laser fiber array to emit a plurality of laser beams from selected fibers of the diode laser fiber array onto the powder bed, the selected fibers of the array corresponding to a pattern of a layer of the build and simultaneously melt the powder in the powder bed corresponding to the pattern of the layer of the build.
Inventors:
Jones, Marshall Gordon
Carter, william thomas
James William, Sears
Carter, william thomas
James William, Sears
Application Number:
JP2016537994A
Publication Date:
November 01, 2017
Filing Date:
December 08, 2014
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
B23K26/342; B22F3/105; B22F3/16; B23K26/00; B23K26/21; B23K26/34; B29C67/00; B33Y10/00; B33Y30/00; B33Y50/02; F01D5/14; F01D5/28; F01D9/02; F01D25/00; F02C7/00
Foreign References:
| US20030214571 | ||||
| US20130136868 |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka