Title:
ELECTRONIC MODULE AND DEVICE
Document Type and Number:
Japanese Patent JP2023148524
Kind Code:
A
Abstract:
To provide an advantageous technique for improving the connection strength between a rigid printed wiring member and a flexible printed wiring member.SOLUTION: An electronic module 14 includes a rigid printed circuit member 11 having a pad electrode 9, a flexible printed wiring member 12 having a connection electrode 4, and a solder member 5 joined to the pad electrode 9 and the connection electrode 4. The solder member 5 includes a rear portion 51, an intermediate portion 52, and a front portion 53, and the height Hc of the front portion 53 is greater than the height Hb of the intermediate portion 52 and smaller than the height of the rear portion 51.SELECTED DRAWING: Figure 2
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Inventors:
NOGUCHI YUKITSUGU
HIGUCHI SATORU
HASEGAWA MITSUTOSHI
HIGUCHI SATORU
HASEGAWA MITSUTOSHI
Application Number:
JP2022056601A
Publication Date:
October 13, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
CANON KK
International Classes:
H05K1/14; H01L23/02; H01L27/146
Attorney, Agent or Firm:
Takuma Abe
Sougo Kuroiwa
Sougo Kuroiwa