Title:
An electronic-parts package and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP5905525
Kind Code:
B2
Abstract:
An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules.
Inventors:
Akio Nakao
Hidenobu Takemoto
Hidenobu Takemoto
Application Number:
JP2014138411A
Publication Date:
April 20, 2016
Filing Date:
July 04, 2014
Export Citation:
Assignee:
SAE Magnetics(H.K.)Ltd.
International Classes:
H01L23/28; H01L21/56
Domestic Patent References:
| JP2012151326A | ||||
| JP2005109306A |
Attorney, Agent or Firm:
Kazuyuki Shirai
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