An electronic-parts separation device of a printed circuit board

Japanese Patent JP6212997

B2

PROBLEM TO BE SOLVED: To provide an improved electronic component separation apparatus which uses swirling airflow generated in a cylindrical heating vessel in a component separation process by a centrifugal separation method in a printed circuit board, and is capable of surely discharging and recovering electronic components and a circuit board separated from a printed circuit board to be processed from a heating vessel.SOLUTION: A rotary holding mechanism that holds a printed circuit board to be processed is provided for a cylindrical heating vessel 21 mounted on a support frame 10, and a separated components recovery box 50 is provided from a component outlet port 21a open on a peripheral wall of the vessel while extending in a tangential direction continuously from the outlet port. At the point where superheated steam is supplied to the heating vessel 21 and heated until a brazing material of the printed circuit board melts, the rotary holding mechanism is driven to rotate to centrifugally separate electronic components from the printed circuit board, and the electronic components and the circuit board are driven to swirl by swirling airflow generated in the heating vessel with the rotation drive of the rotary holding mechanism, and discharged and recovered from an outlet port of the heating vessel 21 to the separated components recovery box 50.

Maruta Yuri
Fujita Mitsuru

JP2013143463A

October 18, 2017

July 09, 2013

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Fuji Electric Co., Ltd.

B09B3/00; H05K3/34; B23K1/00; B23K1/018

JP2013110379A
JP10107426A
JP5637699A
JP2012138397A
JP2008085067A

Iwao Yamaguchi
Hiroshi Yamamoto

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