The end for a paste of solder alloyed powder, a paste, and the solder vamp using this

Title:

The end for a paste of solder alloyed powder, a paste, and the solder vamp using this

Document Type and Number:

Japanese Patent JP6004253

Kind Code:

B2

Inventors:

Masayuki Ishikawa
Hiroki Uno
Takashi Yamaji

Application Number:

JP2012113041A

Publication Date:

October 05, 2016

Filing Date:

May 17, 2012

Export Citation:

Assignee:

Mitsubishi Materials Corporation

International Classes:

B23K35/26; B23K1/00; B23K35/22; C22C13/00; H01L21/60; H05K3/34

Domestic Patent References:

Attorney, Agent or Firm:

Hideyuki Sugiura

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