Title:
フィルム金属積層体、その製造方法、前記フィルム金属積層体を用いた回路基板、および前記回路基板の製造方法
Document Type and Number:
Japanese Patent JP4865381
Kind Code:
B2
Inventors:
Zama Satoru
Yoshiaki Ogiwara
Kenichi Oga
Yoshiaki Ogiwara
Kenichi Oga
Application Number:
JP2006093222A
Publication Date:
February 01, 2012
Filing Date:
March 30, 2006
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C23C18/52; B32B15/08; C23C18/16; C23C28/02; C23F1/28; C23F1/34; C25D5/50; C25D5/56; C25D7/00; H05K1/09; H05K3/06
Domestic Patent References:
| JP58119607A | ||||
| JP2006502590A | ||||
| JP10229280A | ||||
| JP2003183857A | ||||
| JP2005060772A | ||||
| JP2004307980A | ||||
| JP2002374055A | ||||
| JP2004228129A | ||||
| JP2000216201A | ||||
| JP2005248225A | ||||
| JP2005154895A |
Attorney, Agent or Firm:
Ryo Matsushita