Title:
A grinding method and a polish device
Document Type and Number:
Japanese Patent JP6225088
Kind Code:
B2
Abstract:
A polishing method which can properly inflate a membrane of a polishing head when a substrate, such as a wafer, is released from the polishing head, is disclosed. In this method, the substrate is polished while moving a polishing table and the polishing head relative to each other. The polishing head has a substrate holding surface and a membrane formed by a membrane. Further, a secondary-side valve is closed and a primary-side valve is opened, thereby storing a fluid, having a pressure adjusted by a pressure regulator, in a fluid storage element. The primary-side valve is then closed and the secondary-side valve is opened to supply the fluid from the fluid storage element into a pressure chamber of the polishing head, thereby inflating the membrane to form a gap between the substrate and the membrane. A releasing shower is ejected into this gap to thereby release the polished substrate from the polishing head.
Inventors:
Hiroyuki Shinozaki
Application Number:
JP2014186404A
Publication Date:
November 01, 2017
Filing Date:
September 12, 2014
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/30; B24B37/005; H01L21/304; H01L21/683
Domestic Patent References:
| JP2014004683A | ||||
| JP2011258639A | ||||
| JP2015131360A | ||||
| JP2015104790A |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa
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