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Title:
An insulating resin composition, its hardening object, and a hybrid integrated circuit using it
Document Type and Number:
Japanese Patent JP6061904
Kind Code:
B2
More Like This:
JPS61183295COPOLYMERIZABLE DIBENZALACETONE PALLADIUM COMPLEX AND ITS USE
JP2001192538CURABLE EPOXY RESIN COMPOSITION WITH BROMINATED TRIAZINE FLAME RETARDANT
Inventors:
Kenji Miyata
Honma Sao
Yuki Kimoto
Kazuyuki Igarashi
Application Number:
JP2014189664A
Publication Date:
January 18, 2017
Filing Date:
September 18, 2014
Export Citation:
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Assignee:
Denka Co., Ltd.
International Classes:
C08G59/18; C08K3/00; C08K5/3417; C08L63/00
Domestic Patent References:
JP2005082626A
JP2009164093A
JP9100394A
JP2011241279A



 
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