Title:
BONDING DEVICE FOR ELECTRODE MATERIAL, BONDING METHOD FOR ELECTRODE MATERIAL, AND ELECTRODE MATERIAL
Document Type and Number:
Japanese Patent JP2018085205
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress an active material from falling from an active material mixture layer.SOLUTION: A bonding device for an electrode material includes: a holding part 52 holding both exposed portions 44 of electrode materials 41, 42; a motor 59 rotating the holding part 52; and a pressing part pressing a layered part formed by the rotation of the holding part 52. The holding part 52 holding both exposed portions 44 of electrode materials 41, 42 is wound, so that the exposed portions 44 of the electrode materials 41, 42 are overlapped in layers. The layered part is pressed by the pressing part, so that the electrode materials 41, 42 are bonded.SELECTED DRAWING: Figure 2
Inventors:
KINOSHITA KYOICHI
YAMAUCHI KAZUTERU
KONDO SHINICHI
YAMAUCHI KAZUTERU
KONDO SHINICHI
Application Number:
JP2016227033A
Publication Date:
May 31, 2018
Filing Date:
November 22, 2016
Export Citation:
Assignee:
TOYOTA IND CORP
International Classes:
B21D33/00; B21D53/00; H01M4/02; H01M4/04; H01M4/13
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
Previous Patent: Electrode binder layer
Next Patent: A joining apparatus of electrode material, and a joining method of electrode material
Next Patent: A joining apparatus of electrode material, and a joining method of electrode material