Title:
発光装置
Document Type and Number:
Japanese Patent JP7371089
Kind Code:
B2
Abstract:
A light emitting device is provided. The light emitting device includes a first light emitting part including a first ohmic layer, a second light emitting part and including a second ohmic layer, a third light emitting part including first and second metal patterns respectively contacting semiconductor layers thereof, a first pad electrically coupled with the first ohmic layer, a second pad electrically coupled with the second ohmic layer, a third pad electrically coupled with the first metal pattern, a common pad electrically coupled with a semiconductor layer of the first and second light emitting parts and the second metal pattern, and a via structure electrically coupling the second metal pattern and the common pad between the second metal pattern and the common pad, in which the second metal pattern has a first portion contacting the first via structure and a second portion contacting the semiconductor layer of the third light emitting part.
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Inventors:
Jean, Song Gyu
Lee, Heo Jun
Choi, Jonghyun
Lee, Heo Jun
Choi, Jonghyun
Application Number:
JP2021510345A
Publication Date:
October 30, 2023
Filing Date:
September 10, 2019
Export Citation:
Assignee:
SEOUL VIOSYS CO.,LTD.
International Classes:
H01L33/08; H01L33/14; H01L33/38; H01L33/44
Domestic Patent References:
| JP2001156327A | ||||
| JP2014175427A | ||||
| JP7030153A | ||||
| JP2011216886A |
Foreign References:
| US20170288093 | ||||
| US20090078955 | ||||
| CN102593303A | ||||
| US20170092820 |
Attorney, Agent or Firm:
Patent Attorney Corporation Takahashi Hayashi and Partners