Anisotropic conductive film, connection method, bonded body, and manufacturing method of bonded body

Title:

Anisotropic conductive film, connection method, bonded body, and manufacturing method of bonded body

Document Type and Number:

Japanese Patent JP6352979

Kind Code:

B2

More Like This:

JP2011258422	CONNECTOR AND ELECTRONIC APPARATUS
JP3436170	ANISOTROPIC CONDUCTIVE FILM, SEMICONDUCTOR DEVICE USING IT, AND MANUFACTURE THEREOF

Inventors:

Yasunobu Yamada
Naoya Uesawa
Aoki Kazuhisa

Application Number:

JP2016128386A

Publication Date:

July 04, 2018

Filing Date:

June 29, 2016

Export Citation:

Assignee:

Dexerials Co., Ltd.

International Classes:

H01R11/01; C09J7/00; C09J9/02; H01B5/16

Domestic Patent References:

Foreign References:

WO2009038190A1

Attorney, Agent or Firm:

Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda

Previous Patent: The precedence handrail of a temporary structure

Next Patent: JPS6352980