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Title:
A manufacturing method, a circuit board, and an electronic device of a circuit board
Document Type and Number:
Japanese Patent JP6146174
Kind Code:
B2
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Inventors:
Fukumori Taiga
Application Number:
JP2013144431A
Publication Date:
June 14, 2017
Filing Date:
July 10, 2013
Export Citation:
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Assignee:
富士通株式会社
International Classes:
H05K3/46; H05K3/42
Domestic Patent References:
JP2003258427A
JP2009218277A
JP2003309356A
JP10173337A
JP9289374A
JP8288644A
Attorney, Agent or Firm:
Takeshi Hattori



 
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