Title:
ELECTRONIC COMPONENT, CONNECTION BODY, METHOD OF MANUFACTURING CONNECTION BODY, METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND BUFFER MATERIAL
Document Type and Number:
Japanese Patent JP2016058718
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve connection reliability by resolving differential pressure using a heat crimp tool in an electronic component in which an input bump region and an output bump region are arranged along both side edges of a mounting surface opposite to each other.SOLUTION: On a mounting surface 2 connected to a circuit board 10, an output bump region 4 is provided in which output bumps 3 are arrayed along one side 2a of a pair of side edges opposite to each other, and an input bump region 6 is provided in which input bumps 5 are arrayed along the other side 2b of the pair of side edges. On a pressed surface 8 pressed by a crimping tool on the side opposite to the mounting surface 2, a recess 9 is provided which is overlapped with an inter-bump region 7 between the output bump region 4 and the input bump region 6.SELECTED DRAWING: Figure 1
Inventors:
MITSUNAMI TATSUHIRO
MIYAKE TAKESHI
FUKAYA TATSURO
MIYAKE TAKESHI
FUKAYA TATSURO
Application Number:
JP2015148753A
Publication Date:
April 21, 2016
Filing Date:
July 28, 2015
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
H01L21/60; H05K3/32; H05K13/04
Attorney, Agent or Firm:
Nobuhiro Noguchi