Title:
機能性層の製造方法
Document Type and Number:
Japanese Patent JP5578078
Kind Code:
B2
Abstract:
Provided is a functional layer manufacturing method having a step of irradiating a conductive particle containing layer with electromagnetic waves. By having the step of radiating electromagnetic waves after directly or indirectly arranging the conductive particle containing layer on a conductive body, deterioration due to generation of cracks and carbonization and the like of a constituent material in an irradiation region based on abnormal electrical discharge brought by microwave irradiation is eliminated. Furthermore, a conductive layer and an electronic device manufactured by such manufacturing method are also provided.
Inventors:
Honda Sincerity
Hirai Katsura
Hirai Katsura
Application Number:
JP2010531797A
Publication Date:
August 27, 2014
Filing Date:
August 31, 2009
Export Citation:
Assignee:
Konica Minolta Co., Ltd.
International Classes:
H01L29/786; H01L21/28; H01L21/285; H01L21/336
Domestic Patent References:
| JP2008091126A | 2008-04-17 | |||
| JP2006060064A | 2006-03-02 | |||
| JP2007042690A | 2007-02-15 |
Attorney, Agent or Firm:
Patent business corporation Mitsuaki international patent firm
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