Title:
INSULATION SHEET, WIRING BOARD, AND MANUFACTURING METHOD OF WIRING BOARD
Document Type and Number:
Japanese Patent JP2016219663
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To achieve an insulation sheet excellent in desmear resistance, circuit embeddability, and balance of fine wire formability by laser irradiation.SOLUTION: An insulation sheet is used for forming an insulation layer by forming a recess, in which wiring is embedded, in one surface by laser irradiation and then hardening the recess, and includes a first resin layer located on the first surface, and a second resin layer located on the other surface opposite to the first surface. The first resin layer contains first silica particles having a median diameter Dof 0.2 μm or less, and two exothermic peaks occur in a DSC curve obtained when raising the temperature from 30°C to 350°C, under conditions of temperature rise rate of 10°C/min, by using a differential scanning calorimeter.SELECTED DRAWING: Figure 1
Inventors:
TAKAHASHI RYOHEI
SATO KOJI
DAITO NORIYUKI
SATO KOJI
DAITO NORIYUKI
Application Number:
JP2015104736A
Publication Date:
December 22, 2016
Filing Date:
May 22, 2015
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H05K1/03; B32B3/30; B32B27/08; H01B17/56; H05K3/00; H05K3/10; H05K3/46
Attorney, Agent or Firm:
Shinji Hayami
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