Title:
A manufacturing method of a luminescence module
Document Type and Number:
Japanese Patent JP6076685
Kind Code:
B2
Abstract:
A light-emitting module with improved light extraction efficiency and reliability is provided. In the light-emitting module, an element substrate with gas barrier properties is used; a light-emitting element is optically connected to one surface side of the element substrate; and a diffuse reflection layer is in contact with the other surface side of the element substrate. The diffuse reflection layer has a diffuse reflectance of greater than or equal to 75% and less than 100%. The light-emitting element includes a layer containing a light-emitting organic compound between a pair of light-transmitting electrodes. The element substrate transmits light emitted from the light-emitting element; the refractive index of the element substrate is different from that of layer containing a light-emitting organic compound by 0.2 or less.
Inventors:
Toshio Ikeda
Application Number:
JP2012232204A
Publication Date:
February 08, 2017
Filing Date:
October 19, 2012
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H05B33/02; H01L51/50; H05B33/04; H05B33/10; H05B33/26; H05B33/28
Domestic Patent References:
| JP2008234930A | ||||
| JP2010198797A | ||||
| JP2003225970A | ||||
| JP2008234933A | ||||
| JP2010157515A | ||||
| JP2010170969A | ||||
| JP2009032786A |
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