Title:
A manufacturing method and a manufacture device of an injection-molded product which were packed
Document Type and Number:
Japanese Patent JP6063253
Kind Code:
B2
Inventors:
Shota Takamatsu
Application Number:
JP2012284887A
Publication Date:
January 18, 2017
Filing Date:
December 27, 2012
Export Citation:
Assignee:
Enplus Inc.
International Classes:
B65B9/04
Domestic Patent References:
| JP2010083586A | ||||
| JP2002011782A | ||||
| JP58089319A |
Attorney, Agent or Firm:
Koichi Washida
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