Title:
A manufacturing method of a mold package
Document Type and Number:
Japanese Patent JP6156085
Kind Code:
B2
Inventors:
Hiroyuki Yamakawa
Application Number:
JP2013235794A
Publication Date:
July 05, 2017
Filing Date:
November 14, 2013
Export Citation:
Assignee:
株式会社デンソー
International Classes:
B29C43/20; B29C39/18; B29C39/20; B29C43/18; H01L21/56
Domestic Patent References:
| JP2000293651A | ||||
| JP2000223623A | ||||
| JP2011131421A | ||||
| JP2008153573A | ||||
| JP11219984A | ||||
| JP2000048162A | ||||
| JP2013101990A | ||||
| JP4935957B2 | ||||
| JP2006079629A | ||||
| JP63056417A |
Foreign References:
| US6157080 | ||||
| EP0915505A1 | ||||
| US20010002874 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office