A manufacturing method of a polyamide imide solution and a polyamide imide film

Japanese Patent JP6010531

B2

An object of the present invention is to obtain a polyamide-imide solution that has a low linear thermal expansion coefficient, that is, an excellent linear thermal expansion coefficient, and that also is excellent in coating applicability. A further object of the present invention is to provide, with use of the polyamide-imide solution, a product or member which has high requirements for heat resistance and a low linear thermal expansion coefficient. In particular, the present invention is intended to provide a product or member that is suitably used for applications in which the polyamide-imide film obtained from the polyamide-imide solution of the present invention is formed on a surface of an inorganic material such as metal, metal oxide, or monocrystalline silicon. The above objects can be achieved by a polyamide-imide solution including: a specific polyamide-imide; and an organic solvent, the organic solvent being a mixture solvent of an amide solvent and a non-amide solvent, the non-amide solvent being at least one solvent selected from the group consisting of ether solvents, ketone solvents, ester solvents, glycol ether solvents, and glycol ester solvents.

Mari Fujii
Tomonori Iwamoto
Masatoshi Hasegawa

JP2013511036A

October 19, 2016

April 19, 2012

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Kaneka Corporation

C08G73/14; B32B17/10; B32B27/34; C08J5/18; C08L79/08; H01L21/336; H01L29/786

JP2012077144A	2012-04-19
JP2010106225A	2010-05-13
JP2006002163A	2006-01-05
JP2008285660A	2008-11-27
JP2004231946A	2004-08-19
JP5606257B2	2014-10-15
JP2012077144A	2012-04-19

WO2011065131A1	2011-06-03
WO2011065131A1	2011-06-03

Nao Murakami

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