A manufacturing method of a semiconductor device - Semiconductor Energy Laboratory Co., Ltd.

Title:

A manufacturing method of a semiconductor device

Document Type and Number:

Japanese Patent JP6246549

Kind Code:

B2

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Inventors:

Shunpei Yamazaki
Hideomi Suzawa
Shinya Sasakawa

Application Number:

JP2013215931A

Publication Date:

December 13, 2017

Filing Date:

October 17, 2013

Export Citation:

Assignee:

Semiconductor Energy Laboratory Co., Ltd.

International Classes:

H01L29/786; H01L21/28; H01L29/41

Domestic Patent References:

Foreign References:

WO2011058611A1

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