A manufacturing method of a solid imaging device

Title:

A manufacturing method of a solid imaging device

Document Type and Number:

Japanese Patent JP6178561

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide an art favorable to prevent a damage on a micro lens in a manufacturing stage.SOLUTION: A solid state image pickup device manufacturing method comprises the steps of: preparing a structure including a semiconductor layer which has a first surface and a second surface and includes a photoelectric conversion part, and a pad electrode arranged on the semiconductor layer on the first surface side; forming an organic film including a micro lens on the structure on the second surface side of the semiconductor layer; forming an inorganic film on the organic film; forming a resist pattern having a first opening on the inorganic film; forming a second opening in the inorganic film through the first opening of the resist pattern; processing the structure through the second opening of the inorganic film to form a third opening in the structure for exposing the pad electrode; and removing the resist pattern.

Inventors:

Anpei Watanabe

Application Number:

JP2012251500A

Publication Date:

August 09, 2017

Filing Date:

November 15, 2012

Export Citation:

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