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Title:
構造体の製造方法
Document Type and Number:
Japanese Patent JP5574802
Kind Code:
B2
Abstract:
A method for manufacturing a structure includes, in the following order, preparing a substrate having a positive-type photosensitive resin layer and an absorption layer stacked thereon in this order, the absorption layer being capable of absorbing a light having a photosensitive wavelength which the positive-type photosensitive resin senses; pressing a projecting portion of a mold into both the positive-type photosensitive resin layer and the absorption layer; separating the mold from both layers; irradiating the two layers with the light from an upper face side of both layers; removing the absorption layer; and developing the positive-type photosensitive resin layer.

Inventors:
Kanki Sato
Application Number:
JP2010101957A
Publication Date:
August 20, 2014
Filing Date:
April 27, 2010
Export Citation:
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Assignee:
Canon, Inc.
International Classes:
H01L21/027; B29C59/02
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata



 
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