Title:
A manufacturing method of a vacuum lamination device and a semiconductor device
Document Type and Number:
Japanese Patent JP6117715
Kind Code:
B2
Inventors:
Hideki Akiba
Nakamura Tomoyo
Toshio Shiobara
Nakamura Tomoyo
Toshio Shiobara
Application Number:
JP2014028921A
Publication Date:
April 19, 2017
Filing Date:
February 18, 2014
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L21/56
Domestic Patent References:
| JP2010109246A | ||||
| JP2013187340A |
Attorney, Agent or Firm:
Mikio Yoshimiya
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