Title:
METHOD OF MATERIAL PROCESSING BY LASER FILAMENTATION
Document Type and Number:
Japanese Patent JP2017185547
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for internal processing of a transparent substrate in preparation for a cleaving step.SOLUTION: A substrate 14 is translated relative to a laser beam 10 to irradiate the substrate and produce an additional filament 18 at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving the substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation, increasing the filament length, thermally annealing of the filament modification zone to minimize collateral damage, improving reproducibility of processing, and increasing the processing speed compared with the use of low repetition rate lasers.SELECTED DRAWING: Figure 1a
Inventors:
S ABBAS HOSSEINI
PETER R HERMAN
PETER R HERMAN
Application Number:
JP2017066485A
Publication Date:
October 12, 2017
Filing Date:
March 30, 2017
Export Citation:
Assignee:
ROFIN-SINAR TECH INC
International Classes:
B23K26/53; B28D5/00; C03B33/09; H01L21/301
Domestic Patent References:
| JP2008100284A | 2008-05-01 | |||
| JP2008098465A | 2008-04-24 | |||
| JP2009023215A | 2009-02-05 | |||
| JP2009050892A | 2009-03-12 | |||
| JP2009056482A | 2009-03-19 | |||
| JP2009072829A | 2009-04-09 | |||
| JP2010082645A | 2010-04-15 | |||
| JP2008062263A | 2008-03-21 | |||
| JPH11207479A | 1999-08-03 |
Attorney, Agent or Firm:
Yusuke Hiraki
Ishikawa Takiharu
Ishikawa Takiharu