Title:
電子機器部品の放熱基板用の金属被覆炭素材料、及び、当該金属被覆炭素材料を用いた放熱基板
Document Type and Number:
Japanese Patent JP4490723
Kind Code:
B2
Inventors:
Masayuki Ito
Takao Matsui
Takao Matsui
Application Number:
JP2004118762A
Publication Date:
June 30, 2010
Filing Date:
April 14, 2004
Export Citation:
Assignee:
Toyo Tanso Co., Ltd.
International Classes:
B22D19/00; H01L23/373; B22D19/14; C04B41/89; C22C1/10; C23C18/31; C25D7/00
Domestic Patent References:
| JP10223810A | ||||
| JP2004023088A | ||||
| JP2001058255A | ||||
| JP2002222887A |
Attorney, Agent or Firm:
Yoshiyuki Kaji
Makoto Suhara
Makoto Suhara