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Title:
非伝導性表面上に伝導性像を形成するための方法
Document Type and Number:
Japanese Patent JP2014525992
Kind Code:
A
Abstract:
The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex, removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.

Inventors:
the Wiz -- Mann and William
Application Number:
JP2014527191A
Publication Date:
October 02, 2014
Filing Date:
August 16, 2012
Export Citation:
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Assignee:
Ground one Circuit Technologies Condominium ration
International Classes:
C23C18/38; C23C18/20; C23C18/22; C23C18/24; C23C18/26; C23C18/30; C25D5/56; C25D7/00; H01L21/28; H01L21/288; H05K3/14; H05K3/38
Domestic Patent References:
JPS5620034A1981-02-25
JP2001089673A2001-04-03
JPS63159410A1988-07-02
JP2010106316A2010-05-13
JPS6147695A1986-03-08
JPS5917223A1984-01-28
JP2011124523A2011-06-23
JP2009280905A2009-12-03
JP2010508398A2010-03-18
Attorney, Agent or Firm:
Shusaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto