Title:
感光性ポリイミド樹脂組成物及びそれを応用したカバーフィルムの製造方法
Document Type and Number:
Japanese Patent JP6577983
Kind Code:
B2
Abstract:
The present invention provides a photosensitive polyimide resin composition comprising an infrared absorbent, an epoxy compound, a photosensitive polyimide and a photoinitiator. The infrared absorbent includes a pigment occupying 5 to 40% of a solid weight of the photosensitive polyimide resin composition. The epoxy compound occupies 5 to 40% of the solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has structure of formula (1) in which m and n are each independently 1 to 600; X is a tetravalent organic group, and a main chain part of the tetravalent organic group includes an alicyclic group; Y is a bivalent organic group, and a main chain part of the bivalent organic group includes a siloxane group; and Z is a bivalent organic group, and a side chain part of the bivalent organic group includes at least a phenol group or a carboxyl group. The photosensitive polyimide occupies 30 to 90% of the solid weight of the photosensitive polyimide resin composition. The photoinitiator occupies 0.1 to 15% of the solid weight of the photosensitive polyimide resin composition. Accordingly, the present invention solves the problem of going through high temperature and baking for a long time for ionic bonding.
Inventors:
Kodo Jie
Apologize
Apologize
Application Number:
JP2017156698A
Publication Date:
September 18, 2019
Filing Date:
August 15, 2017
Export Citation:
Assignee:
Ritsuka Technology Co., Ltd.
International Classes:
G03F7/027; C08G59/40; C08G73/10; C08K3/00; C08K5/00; C08L63/00; C08L79/08; G03F7/004; G03F7/029; G03F7/031; G03F7/40; H05K3/28
Domestic Patent References:
| JP10115914A | ||||
| JP2004325616A | ||||
| JP2010209309A | ||||
| JP2001525561A |
Attorney, Agent or Firm:
Tadashi Terasaki