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Title:
穿孔された多孔質樹脂基材及び穿孔内壁面を導電化した多孔質樹脂基材の製造方法
Document Type and Number:
Japanese Patent JP4543762
Kind Code:
B2
Abstract:

To provide a manufacturing method for a bored porous resin base material capable of accurately forming bores (through hole) with smooth edges at the necessary positions of the porous resin base material without producing the rupture of a porous structure, deformation of the base material, and burrs and a porous resin base material having bored inner wall surface selectively made conductive.

This manufacturing method for the bored porous resin material comprises a step 1 for impregnating a liquid or a solution in the porous structure of the porous resin base material, a step 2 for forming a solid matter from the impregnated liquid or solution, a step 3 for forming the plurality of bores extending from the first surface and passed through the second surface of the porous resin base material having the solid matter in the porous structure, and a step 4 for removing the solid matter from the inside of the porous structure by fusing or dissolving the solid matter. A method of manufacturing the porous resin base material having the conductive bore inner wall surface comprises a step of selectively adhering a catalyst only to the inner wall surfaces of the bores and adhering a conductive metal to the inner wall surfaces.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Taro Fujita
Yasuhiro Okuda
Fumihiro Hayashi
Tsuyoshi Haga
Uenoyama Masayo
Masuda Yasuto
Yuichi Idomoto
Application Number:
JP2004166956A
Publication Date:
September 15, 2010
Filing Date:
June 04, 2004
Export Citation:
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Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
B23B41/00; B29C67/20; C08J9/36; H01R11/01; H01R43/00
Domestic Patent References:
JP2004265844A
JP8506777A
JP7501988A
JP48174B1
Attorney, Agent or Firm:
Shigeaki Nishikawa