Title:
荷電微粒子堆積減少方法および原子炉内の冷却液流路を画成する装置
Document Type and Number:
Japanese Patent JP4943701
Kind Code:
B2
Abstract:
Disclosed is a method for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method includes depositing a first or base dielectric layer (102) and a second or outer dielectric layer (104) on a conductive surface (100) that forms a portion of a high velocity flow path. The first dielectric layer material is selected to provide improved adhesion to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.
Inventors:
Catherine Protic Darka
Young Jin Kim
Rajasin Swarts Israel
David Wesley Sandusky
Kevin H. Janola
Peter W. Brown
Cianzi Tsao
Young Jin Kim
Rajasin Swarts Israel
David Wesley Sandusky
Kevin H. Janola
Peter W. Brown
Cianzi Tsao
Application Number:
JP2005371381A
Publication Date:
May 30, 2012
Filing Date:
December 26, 2005
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
G21D1/00; G21K4/00; A61B6/00; A61B6/02; C23C16/02; C23C16/40; C23C28/04; C23C30/00; G01T1/00; G01T1/20; G02B27/02; G21C15/25; G21C15/28; G21C19/30; G21F9/00; H04N5/30
Domestic Patent References:
JP10130810A | ||||
JP2002207094A | ||||
JP7228963A | ||||
JP2001004789A | ||||
JP2001276628A | ||||
JP63274751A | ||||
JP2004333468A |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Hirokazu Ogura
Toshihisa Kurokawa