Title:
付着力を用いて円盤状基板を分離する方法
Document Type and Number:
Japanese Patent JP2009515349
Kind Code:
A
Abstract:
The present invention relates to a device and a method for dividing up substrates (2) in wafer form (e.g. wafers), which is used in the semiconductor industry, MST (microstructure technology) industry and photovoltaic industry, whereby improved reliability of the process and lower reject rates are accomplished. This object is achieved according to the invention by using adhesion forces that act between the substrates in wafer form and the devices (1) thereby used.
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Inventors:
Kunen, wolf gang
Kunen, Nils Hendrick
Kunen, Nils Hendrick
Application Number:
JP2008539433A
Publication Date:
April 09, 2009
Filing Date:
November 08, 2006
Export Citation:
Assignee:
Kunen, wolf gang
Kunen, Nils Hendrick
Kunen, Nils Hendrick
International Classes:
H01L21/677; B65G49/06; B65G49/07; H01L21/304
Domestic Patent References:
| JP2000156396A | 2000-06-06 | |||
| JPS59145034U | 1984-09-28 | |||
| JPH11156708A | 1999-06-15 | |||
| JPS63251165A | 1988-10-18 | |||
| JP2005019591A | 2005-01-20 | |||
| JPH0717628A | 1995-01-20 |
Attorney, Agent or Firm:
Kazuyoshi Tsujimoto
Nozomi Tsujimoto
Taneichi Jie
Nozomi Tsujimoto
Taneichi Jie