Title:
印刷回路基板をシールドするための方法およびその印刷回路基板
Document Type and Number:
Japanese Patent JP2013515358
Kind Code:
A
Abstract:
The present invention provides a method for shielding a printed circuit board and a printed circuit board. The method includes: providing a substrate; manufacturing at least one layer of copper foil on the substrate; forming a first solder mask layer on the surface layer of copper foil; and forming a carbon oil layer to cover the first solder mask layer, so as to shield wirings of all copper foil layers below the carbon oil layer on the printed circuit board. The printed circuit board includes: a substrate; at least one layer of copper foil, manufactured on the substrate; a first solder mask layer, formed on the surface layer of copper foil; and a carbon oil layer, covering the first solder mask layer. To overcome a disadvantage of an increased cost resulting from shielding a printed circuit board by adding copper foil and a shield cover in the prior art, according to the embodiments of the present invention, a carbon film is utilized to implement shielding on wirings of the printed circuit board, which can guarantee a shielding effect, and meanwhile, lower the cost and simplify production.
Inventors:
Sinking Mr. Ran
Hayashi Bud
Hayashi Bud
Application Number:
JP2012545063A
Publication Date:
May 02, 2013
Filing Date:
August 28, 2010
Export Citation:
Assignee:
Hua For End Co., Ltd.
International Classes:
H05K3/28; H05K1/02; H05K9/00
Domestic Patent References:
| JPH02139993A | 1990-05-29 | |||
| JPH0312991A | 1991-01-21 | |||
| JP2006080340A | 2006-03-23 |
Attorney, Agent or Firm:
Yoshifumi Saeki
Keiji Kiuchi
Keiji Kiuchi