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Title:
A microcapsule thermal storage medium and a thermal storage device using it
Document Type and Number:
Japanese Patent JP6247565
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a microcapsule type thermal storage material which has a thermal storage capacity, is capable of storing heat even in a relatively low temperature range of, e.g. 30-60°C and is improved in thermal storage density and a thermal storage device using the thermal storage material.SOLUTION: A microcapsule thermal storage material contains a phase change material which absorbs and dissipates latent heat in response to a temperature change and is sealed in a microcapsule, and the phase change material contains at least one imide compound selected from tetrabutylphosphonium N-(trifluoromethylsulfonyl)-N-(1-carboxyl-3-methylthiopropyl)imide and tetrabutylphosphonium N-(trifluorometylsulfonyl)-N-(1-carboxyl-4-methylthiobutyl)imide and water. A thermal storage device using the microcapsule thermal storage material is also provided.

Inventors:
Akira Kishimoto
Kentaro Ueda
Kazuki Morita
Application Number:
JP2014037033A
Publication Date:
December 13, 2017
Filing Date:
February 27, 2014
Export Citation:
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Assignee:
OSAKA GAS CO.,LTD.
International Classes:
C09K5/06; F28D20/02
Domestic Patent References:
JP2012021087A
JP2008044849A
JP2007186667A
JP2006249587A
Attorney, Agent or Firm:
Tadaaki Kishimoto