Title:
A mold circuit module and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6121637
Kind Code:
B2
Abstract:
To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual influence, an embodiment provides an encapsulated circuit module M having a substrate 100 on which a number of electronic components 200 are mounted. An electronic component 200A is a high frequency oscillator. A metal side wall 320 of a partition member is provided on the substrate 100. One surface of the substrate 100 is entirely covered with a first resin 400 together with the electronic components 200 and the side wall 320. The first resin 400 is covered with a metal shield layer 600 for shielding electromagnetic waves. The electronic component 200A is surrounded by the side wall 320 and the shield layer 600.
Inventors:
Satoru Miwa
Application Number:
JP2016563205A
Publication Date:
April 26, 2017
Filing Date:
July 10, 2015
Export Citation:
Assignee:
Meiko Co., Ltd.
International Classes:
H05K9/00; H01L23/00; H01L23/28; H01L25/07; H01L25/18; H05K3/28
Domestic Patent References:
| JP2008084964A | ||||
| JP2004172304A | ||||
| JP8037253A | ||||
| JP6275741A | ||||
| JP5004592U | ||||
| JP2011049421A |
Foreign References:
| US20060221591 |
Attorney, Agent or Firm:
Yoshito Muramatsu
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