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Patent Searching and Data


Title:
MOLD DEVICE
Document Type and Number:
Japanese Patent JP2023125419
Kind Code:
A
Abstract:
To solve the following problem: a total volume of an apparatus is increased in conventional mold device.SOLUTION: An aspect of the mold apparatus includes: a fixed die base 11 for supporting a fixed die; a mobile die base 12 for supporting a mobile die; a frame 10 to which the fixed die base 11 is fixed and which extends in the direction of movement of the mobile die base 12 and is formed in a form of a wall surface; and holding means 13, 14 for movably supporting the mobile die base 12 on the frame 10, wherein: the frame 10 is provided along at least one side of the mobile die base except for a top surface of the mobile die base 12 when the device is installed; and the holding means 13 and 14 support the mobile die base 12 at one side of the mobile die base 12.SELECTED DRAWING: Figure 1

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Inventors:
WATANABE HIROYASU
NAKAYAMA SATOSHI
KAWAI AKINOBU
HAMAGUCHI HIROYUKI
Application Number:
JP2022029489A
Publication Date:
September 07, 2023
Filing Date:
February 28, 2022
Export Citation:
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Assignee:
TOYOTA MOTOR CORP
International Classes:
B22C15/02; B29C33/30
Attorney, Agent or Firm:
Ken Ieiri