Mold underfill material for compression molding, semiconductor package, structure and manufacturing method of semiconductor package

Title:

Mold underfill material for compression molding, semiconductor package, structure and manufacturing method of semiconductor package

Document Type and Number:

Japanese Patent JP6303373

Kind Code:

B2

Inventors:

Yusuke Ito

Application Number:

JP2013207235A

Publication Date:

April 04, 2018

Filing Date:

October 02, 2013

Export Citation:

Assignee:

Sumitomo Bakelite Co., Ltd.

International Classes:

C08L63/00; C08G59/18; C08K3/00; C08K3/36; H01L23/29; H01L23/31

Domestic Patent References:

Foreign References:

WO2013145608A1

Attorney, Agent or Firm:

Shinji Hayami

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