Title:
The mounting board of a lamination ceramic capacitor
Document Type and Number:
Japanese Patent JP6021016
Kind Code:
B2
Abstract:
A mounting circuit board of a multilayer ceramic capacitor includes a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween, and first and second external electrodes extended from both end surfaces of the ceramic body to a portion of a lower surface thereof; and a printed circuit board having first and second electrode pads so that the first and second external electrodes are mounted thereon, wherein the first and second electrode pads are disposed in positions diagonally opposed to each other, based on the ceramic body.
Inventors:
Lee, Byun Hwa
Park, Haeun Kill
Lee, Thorn Ju
Arn, Yang Gyu
Park, sansoe
Park, Haeun Kill
Lee, Thorn Ju
Arn, Yang Gyu
Park, sansoe
Application Number:
JP2013269344A
Publication Date:
November 02, 2016
Filing Date:
December 26, 2013
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01G2/06; H01G4/12; H01G4/30
Domestic Patent References:
| JP2004134430A | ||||
| JP2254787A | ||||
| JP2012248581A | ||||
| JP62136096A | ||||
| JP2013065820A |
Foreign References:
| WO2006104032A1 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation
Previous Patent: Human power type transplanter
Next Patent: OPTICAL SYSTEM OF SCANNING PHOTON MICROSCOPE
Next Patent: OPTICAL SYSTEM OF SCANNING PHOTON MICROSCOPE