Title:
高縦横比を有するマイクロスルーヴァイアの製造ばらつきを最小にする多周波数処理
Document Type and Number:
Japanese Patent JP5603095
Kind Code:
B2
Abstract:
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.
Inventors:
ノッディン, David B.
Application Number:
JP2010030457A
Publication Date:
October 08, 2014
Filing Date:
February 15, 2010
Export Citation:
Assignee:
W. El. Goa And Associates, incorporated W. L. GORE& ASSOCIATES, INCORPORATED
International Classes:
B23K26/382; B23K26/18; B23K26/388; H01L21/48; H01L23/12; H01L23/538; H05K3/00; H05K3/40; H05K3/46; H05K3/42
Attorney, Agent or Firm:
Aoki 篤
Tsuruta Junichi
Tsuruta Junichi