Title:
An optical hardenability thermosetting resin composition, its dry film, a hardened material, and the printed wired board using them
Document Type and Number:
Japanese Patent JP6061449
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photo-curable thermosetting resin composition which has excellent storage stability at room temperature as a one liquid type resin composition and a dry film of the resin composition, and has excellent developability, solder heat resistance, insulation reliability, gold plating resistance and the like, and to provide a dry film and a cured product of the same, and a printed wiring board manufactured by forming a cured coating film such as a solder resist with the dry film and the cured product.SOLUTION: The photo-curable thermosetting resin composition which can be stored at normal temperature contains a carboxyl group-containing resin, a photoinitiator, and a plant-derived epoxy compound, preferably, the carboxyl group-containing resin has an acid number of 30-150 mgKOH/g and has a photopolymerizable group, particularly, an ethylenically unsaturated group, and the plant-derived epoxy compound is an epoxidized soybean oil and/or an epoxidized linseed oil.
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Inventors:
Daichi Okamoto
Nobuto Ito
Seio Arima
Nobuto Ito
Seio Arima
Application Number:
JP2011078109A
Publication Date:
January 18, 2017
Filing Date:
March 31, 2011
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
G03F7/004; C08F290/00; C08G59/20; G03F7/038; H05K3/28
Domestic Patent References:
| JP4166944A | ||||
| JP2011075865A | ||||
| JP2008176276A | ||||
| JP56075642A | ||||
| JP7509322A | ||||
| JP2002049148A | ||||
| JP6170955A |
Foreign References:
| WO1994001985A1 |
Attorney, Agent or Firm:
Ichiro Honda
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