Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3055362
Kind Code:
B2
Inventors:
Tetsuro Kawakita
Kenzo Hatada
Kenzo Hatada
Application Number:
JP14049393A
Publication Date:
June 26, 2000
Filing Date:
June 11, 1993
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L23/50; (IPC1-7): H01L21/60; H01L23/50
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)