Title:
POLISHING DEVICE, POLISHING METHOD, AND POLISHING CONTROL PROGRAM
Document Type and Number:
Japanese Patent JP2018001296
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing device that can correct measurement errors caused by delay time in a processing system and the like and estimate data corresponding to a film thickness at present.SOLUTION: A polishing portion 30 polishes a semiconductor wafer 18. An eddy-current sensor 50 measures eddy currents which can be varied responding to change in a film thickness of the semiconductor wafer 18, at a plurality of measurement time. A sensor processing portion 28 calculates film thicknesses of the semiconductor wafer 18 at the measurement time on the basis of the eddy currents measured by the eddy-current sensor 50. A film thickness predicting portion 32 predicts film thicknesses at the time when processing delay time has elapsed since the measurement time using the calculated film thicknesses.SELECTED DRAWING: Figure 1
Inventors:
NAKAMURA AKIRA
Application Number:
JP2016127611A
Publication Date:
January 11, 2018
Filing Date:
June 28, 2016
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B37/34; H01L21/304
Domestic Patent References:
| JP2015156503A | 2015-08-27 | |||
| JP2013252613A | 2013-12-19 | |||
| JP2014003063A | 2014-01-09 | |||
| JP2015519740A | 2015-07-09 | |||
| JP2015076449A | 2015-04-20 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Koichi Kushida
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Koichi Kushida
Makoto Watanabe