Title:
研磨パッド
Document Type and Number:
Japanese Patent JP7210205
Kind Code:
B2
Abstract:
To reduce an end shape of a polished object to be polished by a polishing pad.SOLUTION: In a polishing pad that has a polishing layer formed of a polyurethane resin sheet which is formed by wet film formation and includes much vertically long air bubbles in a thickness direction and polishes a polished object with a polishing surface formed on one surface side of the polishing layer, when a side of the polishing surface from a point equally divided in a thickness direction of the resin sheet is defined as an upper layer and a side opposite to the polishing surface is defined as a lower layer, a volume fraction of the air bubbles in the lower layer is 78-90%.SELECTED DRAWING: None
Inventors:
Keisuke Tanaka
Hiroki Sato
Hiroki Sato
Application Number:
JP2018182737A
Publication Date:
January 23, 2023
Filing Date:
September 27, 2018
Export Citation:
Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/20; C08J9/26
Domestic Patent References:
| JP2010155334A | ||||
| JP2018051698A | ||||
| JP2011073112A |
Other References:
中嶋隆勝,外3名,発泡ポリエチレンの応力-ひずみ関係について,材料,第41巻、第460号,日本,日本材料 学会,1992年01月,p28-33
土肥俊郎,半導体プロセスにおけるCMP技術と適用材料の最新動向,高分子,第55巻、第2号,日本,社団法人高分子学会,2006年02月,p78-81
土肥俊郎,半導体プロセスにおけるCMP技術と適用材料の最新動向,高分子,第55巻、第2号,日本,社団法人高分子学会,2006年02月,p78-81
Attorney, Agent or Firm:
Shuji Shiokawa