Title:
A position adjustment method of a semiconductor laser element and a semiconductor laser element
Document Type and Number:
Japanese Patent JP6272151
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser element and a position adjusting method for the same that can enhance the alignment accuracy when the semiconductor laser element is mounted on a mount substrate.SOLUTION: A semiconductor laser element 30 has a first alignment mark 41 and a second alignment mark 42 used to adjust the position of the semiconductor laser element 30. The first alignment mark 41 and the second alignment mark 42 are configured to have fixed widths in a direction perpendicular to the longitudinal direction of a waveguide formed in an active layer 34 when the semiconductor laser element 30 is viewed in a lamination direction in plan. The first alignment mark 41 extends along the longitudinal direction of the waveguide while one end thereof comes into contact with the cross-section of the semiconductor laser element. The second alignment mark 42 is located at the opposite side to the cross-section side with reference to the other end at the opposite side to the one end of the first alignment mark 41 in contact with the cross-section of the semiconductor laser element 30, and extends along the longitudinal direction of the waveguide.
Inventors:
Takuya Oda
Ryokichi Matsumoto
Ryokichi Matsumoto
Application Number:
JP2014118176A
Publication Date:
January 31, 2018
Filing Date:
June 06, 2014
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
H01S5/022
Domestic Patent References:
| JP2005101044A | ||||
| JP61174765U | ||||
| JP2005005444A | ||||
| JP9178985A | ||||
| JP2008124218A | ||||
| JP5145177A | ||||
| JP2006332329A | ||||
| JP2005236270A | ||||
| JP2002062447A |
Foreign References:
| US20040087113 |
Attorney, Agent or Firm:
Yasuo Morimura
Hiroaki Aoki
Hiroaki Aoki