Title:
電源アダプタ
Document Type and Number:
Japanese Patent JP7309940
Kind Code:
B2
Abstract:
This application provides a power adapter. The power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component. According to the technical solutions of this application, a thermal conduction capability of the power adapter can be improved, so that heat dissipation reliability is high.
More Like This:
Inventors:
Hao U
Jun Chen
Chun Xia Shu
Xiao Wei Hui
Jun Chen
Chun Xia Shu
Xiao Wei Hui
Application Number:
JP2022016313A
Publication Date:
July 18, 2023
Filing Date:
February 04, 2022
Export Citation:
Assignee:
HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
International Classes:
H02M3/00; H05K7/20
Domestic Patent References:
| JP2003060371A | ||||
| JP7067231A |
Foreign References:
| US20140268564 |
Attorney, Agent or Firm:
Shinya Mihiro
Susumu Nomura
Susumu Nomura
Previous Patent: Shelving and storage structure
Next Patent: Footwear with motorized laces and gesture control
Next Patent: Footwear with motorized laces and gesture control