Title:
POWER MODULE
Document Type and Number:
Japanese Patent JP2023032303
Kind Code:
A
Abstract:
To reduce a wiring inductance in a terminal arrangement similar to a conventional type power module.SOLUTION: The power module of an embodiment comprises: a housing in which a control terminal is provided in one end side and an electrode terminal is provided in the other end side; and a circuit board arranged in the housing. The circuit board comprises: a first electrode pattern connected to a first terminal contained in the electrode terminal; a second electrode pattern connected to a second terminal contained in the electrode terminal; and a leg constructed by: a first switching element containing a GaN-based switching element constructing an upper arm and a second switching element containing the GaN-based switching element constructing a lower arm. In the leg, a junction point of the upper arm and the lower arm is connected to a third terminal contained in the electrode terminal. In the circuit board, the first switching element and the second switching element are arranged so as to be nipped between the first electrode pattern and the second electrode pattern.SELECTED DRAWING: Figure 11
Inventors:
ITO SHUICHI
Application Number:
JP2021138348A
Publication Date:
March 09, 2023
Filing Date:
August 26, 2021
Export Citation:
Assignee:
FUJITSU GENERAL LTD
International Classes:
H02M7/48
Attorney, Agent or Firm:
Sakai International Patent Office
Previous Patent: JPWO2023032302
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